Interest expense
Flow – sum over the period · $M
Q2 FY2017
30.6$M
All values (44)
| Period | Value ($M) | Status |
|---|---|---|
| Q4 FY2026 | 73.3 | derived |
| Q3 FY2026 | 70.4 | reported |
| Q2 FY2026 | 69.7 | reported |
| Q1 FY2026 | 71.1 | reported |
| Q4 FY2025 | 73.1 | derived |
| Q3 FY2025 | 71.9 | reported |
| Q2 FY2025 | 75.0 | reported |
| Q1 FY2025 | 82.2 | reported |
| Q4 FY2024 | 82.8 | derived |
| Q3 FY2024 | 80.0 | reported |
| Q2 FY2024 | 74.2 | reported |
| Q1 FY2024 | 74.2 | reported |
| Q4 FY2023 | 73.5 | derived |
| Q3 FY2023 | 74.8 | reported |
| Q2 FY2023 | 74.3 | reported |
| Q1 FY2023 | 74.4 | reported |
| Q4 FY2022 | 44.2 | derived |
| Q3 FY2022 | 40.0 | reported |
| Q2 FY2022 | 37.9 | reported |
| Q1 FY2022 | 38.3 | reported |
| Q4 FY2021 | 40.0 | derived |
| Q3 FY2021 | 39.1 | reported |
| Q2 FY2021 | 38.9 | reported |
| Q1 FY2021 | 39.4 | reported |
| Q4 FY2020 | 40.2 | derived |
| Q3 FY2020 | 39.2 | reported |
| Q2 FY2020 | 40.5 | reported |
| Q1 FY2020 | 40.4 | reported |
| Q4 FY2019 | 40.5 | derived |
| Q3 FY2019 | 31.2 | reported |
| Q2 FY2019 | 26.5 | reported |
| Q1 FY2019 | 26.4 | reported |
| Q4 FY2018 | 28.3 | derived |
| Q3 FY2018 | 28.1 | reported |
| Q2 FY2018 | 27.4 | reported |
| Q1 FY2018 | 30.6 | reported |
| Q4 FY2017 | 30.6 | derived |
| Q3 FY2017 | 30.5 | reported |
| Q2 FY2017 | 30.6 | reported |
| Q1 FY2017 | 30.7 | reported |
| Q4 FY2016 | 30.9 | derived |
| Q3 FY2016 | 30.9 | reported |
| Q2 FY2016 | 30.5 | reported |
| Q1 FY2016 | 30.6 | reported |
CSV with all sources · Technical ID: interest_expense
Interest expense per Gewinn- and Verlustrechnung or Anhang (Tag per Wert in of the Location in filing). TSMC (IFRS): Finanzierungsaufwand (FinanceCosts).
More metrics for KLA
Income statement
Balance sheet
Debt and interest
Revenue by segment/product/region
- Other
- Defect Inspection
- Europe & Israel
- Global Service & Support
- Metrology
- North America
- North America
- Orbotech
- Other
- PCB & Component Inspection
- PCB Display & Component Inspection
- Patterning
- Product
- Rest Of Asia
- Semiconductor Process Control
- Service
- Service
- Specialty Semiconductor Process
- Wafer Inspection
- Land CN
- Land JP
- Land KR
- Land TW
Sources & calculation
- Value
- $31.0M
- Period
- Q2 FY2017, ended Dec 31, 2016 · quarterly value (3 months, not cumulative)
- Source
- 10-Q, filed Jan 27, 2017 · 0000319201-17-000006
- Location
- us-gaap:InterestExpense
- Confidence
- 1. – directly from an XBRL fact in the filing (or calculated exactly from it)
Versions
| v1 | $31.0M | Jan 27, 2017 | 10-Q 0000319201-17-000006 | reported · confidence 1. · current |