Interest paid
Flow – sum over the period · $M
Q3 FY2023
125.1a$M
derived
All values (44)
| Period | Value ($M) | Status |
|---|---|---|
| Q4 FY2026 | 11.9 | derived |
| Q3 FY2026 | 131.4 | derived |
| Q2 FY2026 | 7.7 | derived |
| Q1 FY2026 | 131.5 | reported |
| Q4 FY2025 | 7.8 | derived |
| Q3 FY2025 | 128.8 | derived |
| Q2 FY2025 | 25.1 | derived |
| Q1 FY2025 | 131.1 | reported |
| Q4 FY2024 | 25.2 | derived |
| Q3 FY2024 | 113.4 | derived |
| Q2 FY2024 | 24.8 | derived |
| Q1 FY2024 | 113.2 | reported |
| Q4 FY2023 | 25.0 | derived |
| Q3 FY2023 | 125.1 | derived |
| Q2 FY2023 | 29.6 | derived |
| Q1 FY2023 | 44.2 | reported |
| Q4 FY2022 | 37.9 | derived |
| Q3 FY2022 | 40.0 | derived |
| Q2 FY2022 | 37.1 | derived |
| Q1 FY2022 | 39.7 | reported |
| Q4 FY2021 | 37.2 | derived |
| Q3 FY2021 | 40.0 | derived |
| Q2 FY2021 | 36.9 | derived |
| Q1 FY2021 | 40.1 | reported |
| Q4 FY2020 | 38.0 | derived |
| Q3 FY2020 | 35.2 | derived |
| Q2 FY2020 | 53.1 | derived |
| Q1 FY2020 | 26.3 | reported |
| Q4 FY2019 | 51.5 | derived |
| Q3 FY2019 | 3.9 | derived |
| Q2 FY2019 | 51.1 | derived |
| Q1 FY2019 | 0.5 | reported |
| Q4 FY2018 | 53.2 | derived |
| Q3 FY2018 | 2.3 | derived |
| Q2 FY2018 | 55.7 | derived |
| Q1 FY2018 | 3.0 | reported |
| Q4 FY2017 | 56.9 | derived |
| Q3 FY2017 | 3.1 | derived |
| Q2 FY2017 | 56.8 | derived |
| Q1 FY2017 | 3.2 | reported |
| Q4 FY2016 | 57.1 | derived |
| Q3 FY2016 | 3.5 | derived |
| Q2 FY2016 | 56.7 | derived |
| Q1 FY2016 | 3.1 | reported |
CSV with all sources · Technical ID: interest_paid
Interest paid per Kapitalflussrechnung (Zusatzangaben); Ersatzgröße, wenn kein Interest expense getaggt ist.
More metrics for KLA
Income statement
Balance sheet
Debt and interest
Revenue by segment/product/region
- Other
- Defect Inspection
- Europe & Israel
- Global Service & Support
- Metrology
- North America
- North America
- Orbotech
- Other
- PCB & Component Inspection
- PCB Display & Component Inspection
- Patterning
- Product
- Rest Of Asia
- Semiconductor Process Control
- Service
- Service
- Specialty Semiconductor Process
- Wafer Inspection
- Land CN
- Land JP
- Land KR
- Land TW
Sources & calculation
- Value
- $125M (derived)
- Period
- Q3 FY2023, ended Mar 31, 2023 · quarterly value (3 months, not cumulative)
- Calculation
- Q3 = 9 months kumuliert − 6 months kumuliert = 199M − 74M = $125M (us-gaap:InterestPaidNet; 9-Monats-Wert aus 0000319201-24-000012, Vorperiode aus dem vorherigen 10-Q)
- Source
- 10-Q, filed Apr 26, 2024 · 0000319201-24-000012
- Location
- us-gaap:InterestPaidNet
- Confidence
- 1. – directly from an XBRL fact in the filing (or calculated exactly from it)
Versions
| v1 | $125M | Apr 26, 2024 | 10-Q 0000319201-24-000012 | derived · confidence 1. · current |