Current liabilities
Balance – as of period end · $M
Q1 FY2018
1,466$M
All values (44)
| Period | Value ($M) | Status |
|---|---|---|
| Q4 FY2026 | 4,305 | reported |
| Q3 FY2026 | 3,752 | reported |
| Q2 FY2026 | 3,982 | reported |
| Q1 FY2026 | 4,050 | reported |
| Q4 FY2025 | 4,086 | reported |
| Q3 FY2025 | 3,910 | reported |
| Q2 FY2025 | 4,138 | reported |
| Q1 FY2025 | 4,798 | reported |
| Q4 FY2024 | 4,661 | reported |
| Q3 FY2024 | 4,459 | reported |
| Q2 FY2024 | 4,571 | reported |
| Q1 FY2024 | 3,818 | reported |
| Q4 FY2023 | 3,743 | reported |
| Q3 FY2023 | 3,419 | reported |
| Q2 FY2023 | 3,483 | reported |
| Q1 FY2023 | 3,139 | reported |
| Q4 FY2022 | 2,871 | reported |
| Q3 FY2022 | 2,829 | reported |
| Q2 FY2022 | 2,776 | reported |
| Q1 FY2022 | 2,523 | reported |
| Q4 FY2021 | 2,103 | reported |
| Q3 FY2021 | 2,029 | reported |
| Q2 FY2021 | 2,020 | reported |
| Q1 FY2021 | 1,749 | reported |
| Q4 FY2020 | 1,700 | reported |
| Q3 FY2020 | 1,653 | reported |
| Q2 FY2020 | 1,718 | reported |
| Q1 FY2020 | 1,943 | reported |
| Q4 FY2019 | 1,768 | reported |
| Q3 FY2019 | 1,701 | reported |
| Q2 FY2019 | 1,483 | reported |
| Q1 FY2019 | 1,311 | reported |
| Q4 FY2018 | 1,214 | reported |
| Q3 FY2018 | 1,200 | reported |
| Q2 FY2018 | 1,167 | reported |
| Q1 FY2018 | 1,466 | reported |
| Q4 FY2017 | 1,293 | reported |
| Q3 FY2017 | 1,249 | reported |
| Q2 FY2017 | 1,188 | reported |
| Q1 FY2017 | 975 | reported |
| Q4 FY2016 | 1,002 | reported |
| Q3 FY2016 | 998 | reported |
| Q2 FY2016 | 858 | reported |
| Q1 FY2016 | 915 | reported |
CSV with all sources · Technical ID: liabilities_current
More metrics for KLA
Income statement
Balance sheet
Debt and interest
Revenue by segment/product/region
- Other
- Defect Inspection
- Europe & Israel
- Global Service & Support
- Metrology
- North America
- North America
- Orbotech
- Other
- PCB & Component Inspection
- PCB Display & Component Inspection
- Patterning
- Product
- Rest Of Asia
- Semiconductor Process Control
- Service
- Service
- Specialty Semiconductor Process
- Wafer Inspection
- Land CN
- Land JP
- Land KR
- Land TW
Sources & calculation
- Value
- $1.5B
- Period
- Q1 FY2018, ended Sep 30, 2017 · as of Sep 30, 2017 (balance as of date, not a sum)
- Source
- 10-Q, filed Oct 27, 2017 · 0000319201-17-000045
- Location
- us-gaap:LiabilitiesCurrent
- Confidence
- 1. – directly from an XBRL fact in the filing (or calculated exactly from it)
Versions
| v1 | $1.5B | Oct 27, 2017 | 10-Q 0000319201-17-000045 | reported · confidence 1. · current |